3D Dimensional Printed Circuit Boards will become possible!

In the JakajimaTV interview with Martin Hedges, Owner of Neotech AMT Gmbh, he explains to interviewer Pieter Hermans which possibilities 3D Printing Electronics offers for the industry.

A reconfigurable array of printing, pre- and post-processing techniques are combined to enable 100% CAD driven printed electronics manufacturing. The resultant flexible process chain can be easily reconfigured to cope with rapid changes in product type whilst retaining the ability to be scaled through to high volume manufacture. In addition, a review of current 3D printed systems, including antenna, heaters and sensors will be conducted. It is clear that 3D Printing electronics creates 3D Dimensional alternatives for Printed Circuit Boards.

About Neotech AMT GmbH
Neotech AMT GmbH is one of the leading companies developing systems for 3D Printed Electronics (3D PE). The company installed the first 5 axis 3D PE system in 2010. Rapid advances lead to the first commercial installation for mass production for printed 3D circuits in mobile communications devices in 2015.

About Dr. Martin Hedges
“Graduated BSc (Materials Science) from the University of Manchester (UK) in 1987. Completed a PhD in Materials Science in 1990 from UMIST (UK).Founded the company Neotech in Nuremberg in 2001 to develop additive manufacturing processes with a focus on Printed Electronics Since 2009 the company has been pioneering the development of 3D Printed Electronics.”

Find more information about Neotech AMT Gmbh and how 3D Printing Electronics offers 3D Dimensional alternatives for Printed Circuit Boards on this site.

Neotech has been involved in two European Projects for Fully Additive 3D Printed Electronics (3D PE): In the EU PENTA project “Hyb-Man”, 11 partners from Germany and the Netherlands will develop hybrid 3D manufacturing methods to enable flexible first time right production of smart systems.

The second project is AMPECS funded by EU Manunet Program, and is about a fully additive manufacturing process for 3D Printing Electronics with ceramic substrates will be developed. The German-Spanish consortium will develop 3D printable ceramic materials for creating the structural body and integrate printed electronics into and onto this component. End use applications will cover areas where harsh environments exists such as automotive and aerospace as well as in mobile communications.

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