Press release: 3D Printing Electronics Conference at High Tech Campus Eindhoven

Press release: 3D Printing Electronics Conference at High Tech Campus Eindhoven

Eindhoven – On January 22, 2019, internationally renowned specialists will gather at High Tech Campus Eindhoven to discuss the latest technological developments in 3D Printing Electronics.

The program features ten internationally renowned speakers from Mitsubishi Engineering Plastics, NANO Dimension, Fraunhofer IFAM, Holst Centre, Institute of Systems and Robotics, Portugal, Neotech AMT, TNO – AMSYSTEMS, Metafas, DoMicro BV and Fontys University of Applied Sciences who will share their knowledge and expertise on a variety of topics related to 3D Printing Electronics.

The discussions will focus on topics such as Printing of metal structures on 3D-printed polymer parts, Printed Stretchable Circuits, Semiconductor Processing Approach to Additive Manufacturing of Printed Electronics, Integrated Electronic Functionalities in 3D Printed Products, Hybrid electronics integration by inkjet technology and many more.

Furthermore, the conference also includes a business matchmaking session hosted by Enterprise Europe Network and an expo where Neotech AMT, Van Mierlo, Berenschot, DoMicro BV, Fontys University of Applied Sciences, Holst Centre, LifeSense Group and Metafas will be exhibit the latest product developments in the field.

For more information about the program, we invite you to visit

 About Jakajima

Jakajima is the matchmaker for innovators in the high tech industry, ranging from 3D printing to Internet of Things, from Drones to Health Tech. We organize those activities that bring innovators from different value chains and different professions together, in order to endeavour innovations and to create new partnerships, products and/or services.

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About High Tech Campus Eindhoven

High Tech Campus Eindhoven is an open innovation R&D hotspot. It is the smartest km² in the Netherlands with more than 160 companies, startups and institutes on the Campus grounds.